Thermal Interface Materials
LTR295LV Gray One-Component Thermally Conductive Paste
SKU: LTR295LV
Brand: Momentive
Pricing on request
Specifications
| Part Number | LTR295LV |
|---|---|
| Material | Silicone (Room Temperature (Alkoxy) cure) |
Description
LTR295LV is a one-component, room-temperature alkoxy-cure silicone paste filled for thermal conductivity, curing in place to a compliant grey elastomer. It is applied between power components, boards and heat sinks or chassis to replace air gaps with a conductive path while still absorbing thermal expansion mismatch. Alkoxy cure keeps the chemistry non-corrosive around electronics, and the grade is specified as low outgassing for enclosed and vacuum-exposed builds.
Angad Aviation supplies this material for purchase. Request a quote for pack sizes, current price and lead time. Documentation is available on request.
- Manufacturer: Momentive
- Part No.: LTR295LV
- Cure type: Room Temperature (Alkoxy)
- Notable property: Low outgassing
Frequently asked
Does the bondline thickness affect how well this cures?
Yes. As a one-component moisture-cure paste it cures inward from the exposed edges, so thin, well-exposed bondlines cure predictably while thick or fully enclosed sections cure slowly from the perimeter in. Thin bondlines are the thermally preferable design anyway, since the interface material is the resistive layer in the stack.
How do I choose between LTR295LV and LTR395LV?
Both are grey one-component thermally conductive pastes specified as low outgassing, but they cure differently. LTR295LV is alkoxy moisture-cure and needs air access to the bondline; LTR395LV is an addition-cure grade that does not depend on ambient humidity and is characterised as electrically insulative, which is the one to specify when the interface must isolate as well as conduct.
How do I get pricing, pack sizes and lead time?
Angad Aviation supplies this product quote-first. Request a quote with the grade and quantity you need and our team confirms available pack sizes, current price and lead time.
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