Thermal Interface Materials

TSE3281-G Thermally Conductive Adhesive (1.7 W/mk)

SKU: TSE3281-G

Brand: Momentive

Pricing on request

Specifications

Part Number	TSE3281-G
Material	Silicone (1P Addition cure)
Compliance	ASTM E595

Description

Momentive TSE3281-G is a one-part, addition-cure silicone adhesive with a thermal conductivity of 1.7 W/mK, listed with ASTM E595 for outgassing. It bonds electronic components to heat sinks and housings while carrying heat away. Follow the data sheet for surface preparation and cure conditions.

Angad Aviation supplies this part with full traceability and documentation — request a quote for current pricing, pack sizes and lead time.

Brand: Momentive
Part No.: TSE3281-G

Frequently asked

What does W/mK mean?

Watts per metre-kelvin, the unit of thermal conductivity. A higher figure means the material conducts heat better.

What does ASTM E595 cover?

It is a test method for outgassing of materials in a vacuum, used where materials must not contaminate nearby optics or electronics.

How do I get pricing and lead time?

Angad Aviation supplies this part quote-first — click Request a Quote and our team responds with current price, available pack sizes, and lead time. Parts ship with traceability and, where required, an authorized-release certificate you can verify online via Angad Verified.