Thermal Interface Materials
TSE3281-G Thermally Conductive Adhesive (1.7 W/mk)
SKU: TSE3281-G
Brand: Momentive
Pricing on request
Specifications
| Part Number | TSE3281-G |
|---|---|
| Material | Silicone (1P Addition cure) |
| Compliance | ASTM E595 |
Description
TSE3281-G Thermally Conductive Adhesive (1.7 W/mk) from Momentive is an adhesive used for reliable bonding in assembly and maintenance; follow the manufacturer's surface-preparation and cure guidance for best results.
Angad Aviation supplies this part with full traceability and documentation — request a quote for current pricing, pack sizes and lead time.
- Brand: Momentive
- Part No.: TSE3281-G
Frequently asked
What surfaces does it bond?
Refer to the manufacturer datasheet for compatible substrates, cure schedule and shelf life.
How do I get pricing and lead time?
Angad Aviation supplies this part quote-first — click Request a Quote and our team responds with current price, available pack sizes, and lead time. Parts ship with traceability and, where required, an authorized-release certificate you can verify online via Angad Verified.