
Adhesives
Loctite EF 560 AERO (Hysol MA 560) Expanding Epoxy Film
SKU: MA 560
Brand: Henkel
Pricing on request
Specifications
| Part Number | MA 560 |
|---|---|
| Material | Expanding epoxy film adhesive, low density |
Description
Loctite EF 560 AERO, known as Hysol MA 560, is a low-density, expanding epoxy film adhesive supplied in sheets. Henkel states that it may be cured at 121 °C (250 °F) or 177 °C (350 °F) and is designed for service from -55 °C (-67 °F) to 177 °C (350 °F). The guide lists an out-time of 30 days at 25 °C.
The manufacturer lists it in its core fill range for core splice and filler work in honeycomb structures.
Angad Aviation supplies this product with full traceability and documentation — request a quote for current pricing, pack sizes and lead time.
- Manufacturer: Henkel
- Part No.: MA 560
- Type: Low-density expanding epoxy film
- Cure: 121 °C (250 °F) or 177 °C (350 °F), 60 minutes
- Service temperature: -55 °C to 177 °C (-67 °F to 350 °F)
- Storage: -18 °C (0 °F)
- Out-time: 30 days at 25 °C
- Tube shear: 1,190 psi (8.2 MPa) at 25 °C
- Form: Sheet
Frequently asked
What is Hysol MA 560?
Henkel describes it, now sold as Loctite EF 560 AERO, as a low-density, expanding epoxy film adhesive. It sits in Henkel's core fill range for splicing and filling honeycomb core.
What service temperature is MA 560 designed for?
Henkel states that it is designed for service from -55 °C (-67 °F) to 177 °C (350 °F), and may be cured at either 121 °C (250 °F) or 177 °C (350 °F).
Can I get the technical and safety data sheets?
Yes. Ask for the current manufacturer technical data sheet and safety data sheet when you request a quote.
How do I order MA 560?
Request a quote with the part number, quantity and delivery country. Angad Aviation confirms availability, pack size and delivery terms. Every order ships with full traceability and documentation.
From other manufacturers
Other manufacturers we source in Adhesives. Not a statement of interchangeability — send us your part number and we will confirm what fits.
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